Sequential injection molding of thermoplastic polymers. Analysis of processing parameters for optimal bonding conditions

Polymer Engineering and Science

Volumn 42, Issue 11, 2002, Pages 2172-2181

  Carella, A R ^a,c   Alonso, C ^a   Merino, J C ^a,b   Pastor, J M ^a,b  

^a FOUNDATION FOR RESEARCH AND DEVELOPMENT IN TRANSPORT AND ENERGY   (Spain)

^b UNIVERSIDAD DE VALLADOLID   (Spain)

^c UNIVERSIDAD NACIONAL DE MAR DEL PLATA   (Argentina)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; INJECTION MOLDING; PRESSURE EFFECTS; THERMAL EFFECTS;

BONDING STRENGTH; SEQUENTIAL INJECTION MOLDING;

THERMOPLASTICS;

EID: 0036863625     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.11107     Document Type: Article

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