Bonding strength at solid-melt interface for polystyrene in a sequential two-staged injection molding process

Polymer Engineering and Science

Volumn 39, Issue 11, 1999, Pages 2159-2171

  Huang, D Y ^a   Chen, R S ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); COOLING; INJECTION MOLDING; MATHEMATICAL MODELS; PHASE INTERFACES; THERMAL EFFECTS;

SOLID-MELT INTERFACE;

POLYSTYRENES;

EID: 0033313639     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.11605     Document Type: Article

References (15)

1. E. M. Hagerman, Plast. Eng., October 1973, p. 67.
2. S. G. Kim and N. P. Suh, Polym. Eng. Sci., 26, 1200 (1986).
3. S. C. Malguarnera and A. Manisali, Polym. Eng. Sci., 21, 586 (1981).
4. S. Piccarolo and M. Saiu, Plast. Rubb. Proc. Appl., 16, 87 (1991).
5. S. Piccarolo and M. Saiu, Plast. Rubb. Proc. Appl., 10, 11 (1988).
6. J. M. Mckelvey and T. H. Strome, Plast. Eng., June 1959, p. 107.
7. K. Tomari, S. Tonogai, and T. Harada, Polym. Eng. Sci., 30, 15 (1990).
8. R. Boukhili, R. Gauvin, and B. Fisa, Plast. Eng., November 1987, p. 37.
9. T. J. Pecorini, Polym. Eng. Sci., 37, 308 (1997).
10. W. W. Graessley, J. Poly. Sci., Polym. Phys., 18, 27 (1980).
11. M. Tirrell, R. Chem. and Tech., 57, 523 (1984).
12. R. P. Wool, B.-L. Yuan, and O. J. McGarel, Polym. Eng. Sci., 29, 1340 (1989).
13. K. Jud, H. H. Kausch, and J. G. Williams, J. Mater. Sci., 16, 204 (1981).
14. rd Ed., p. 468, Elsevier, New York (1990).
15. C-Mold simulation package for injection molding, AC Technology, New York (1998).