Nonisothermal fusion bonding in semicrystalline thermoplastics

Journal of Applied Polymer Science

Volumn 87, Issue 8, 2002, Pages 1267-1276

  Plummer, Christopher J G ^a   Bourban, Pierre Etienne ^a   Zanetto, Jean Emile ^a   Smith, Gregory D ^a   Månson, Jan Anders E ^a  

^a LABORATOIRE DE TECHNOLOGIE DES COMPOSITES ET POLYMÈRES LTC   (Switzerland)

Author keywords

Fracture; Poly(propylene) (PP); Polyamides; Toughness

Indexed keywords

BOND STRENGTH (CHEMICAL); CHEMICAL BONDS; CRACK PROPAGATION; CRYSTALLINE MATERIALS; INTERFACES (MATERIALS); MELTING; POLYAMIDES; POLYPROPYLENES; STRAIN RATE; TEMPERATURE;

CRITICAL STRAIN ENERGY RELEASE RATE; INTERFACIAL BOND STRENGTH; MELTING POINT; NONISOTHERMAL FUSION BONDING; SEMICRYSTALLINE THERMOPLASTICS;

THERMOPLASTICS;

BONDING; FRACTURE; POLYAMIDE; POLYPROPYLENE; STRENGTH; THERMOPLASTIC PROPERTY;

EID: 0037155302     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.11528     Document Type: Article

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