Effects of Al, Ga, and Ag on the anti-oxidation and wetting reactions of Sn-9Zn-X solders

China Welding (English Edition)

Volumn 18, Issue 2, 2009, Pages 57-61

  Wang, Hui ^a   Xue, Songbai ^a   Chen, Wenxue ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Anti oxidation; Interface reaction; Lead free solder; Sn Zn

Indexed keywords

ANTI-OXIDATION; APPARENT ACTIVATION ENERGY; CU SUBSTRATE; CU-SN COMPOUNDS; INTERFACE REACTION; INTERFACE REACTIONS; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE SOLDER; MOLTEN SOLDERS; SCANNING ELECTRON MICROSCOPES; SN-ZN; WETTING REACTION;

ACTIVATION ENERGY; ALUMINUM; AUGER ELECTRON SPECTROSCOPY; BRAZING; GALLIUM; GALLIUM ALLOYS; LEAD; OXIDATION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; WELDING; ZINC;

TIN;

EID: 67650741181     PISSN: 10045341     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

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4. Wang H, Xue S B, Chen W X, et al. Effect of Ag, Al, and Ga addition on wettability of Sn-9Zn lead-free solder. Transactions of the China Welding Institution, 2007, 28(8): 33-36. (in Chinese)
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8. Chen C M, Chen C H. Interfacial reactions between eutectic Sn-Zn solder and bulk or thin-film Cu substrates. Journal of Electronic Materials, 2007, 36(10): 1363-1371.