Micro-structuring of glass with features less than 100 μm by electrochemical discharge machining

Precision Engineering

Volumn 33, Issue 4, 2009, Pages 459-465

  Cao, Xuan Doan ^a   Kim, Bo Hyun ^b   Chu, Chong Nam ^a  

^a Seoul National University   (South Korea)

^b Andong National University   (South Korea)

Author keywords

Electrochemical discharging machining (ECDM); Glass; Micro machining

Indexed keywords

3D MICROSTRUCTURES; ELECTRO CHEMICAL DISCHARGE MACHINING; ELECTROCHEMICAL DISCHARGING MACHINING (ECDM); ELECTROLYTE CONCENTRATION; FEEDRATE; GAS FILMS; HIGH VOLTAGE; IMMERSION DEPTH; LOW VOLTAGES; MECHANICAL CONTACT; MICRO HOLES; MICRO STRUCTURING; MILLING PROCESS; ROTATIONAL SPEED; SURFACE MICROSTRUCTURES; THIN WALLS; TIME RATIO; TOOL ELECTRODE;

ELECTRIC POTENTIAL; ELECTROLYSIS; ELECTROLYTES; GLASS; MICROMACHINING; MILLING (MACHINING); THREE DIMENSIONAL;

ELECTRIC DISCHARGES;

EID: 67650433328     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.precisioneng.2009.01.001     Document Type: Article

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