Grain growth in nanocrystalline copper thin films investigated by non-ambient X-ray diffraction measurements

Powder Diffraction

Volumn 24, Issue 2, 2009, Pages 85-88

  Kuru, Y ^a   Wohlschlogel M ^a   Welzel, U ^a   Mittemeijer, E J ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Grain growth; In situ X ray diffraction; Line profile analysis; Nanocrystalline materials; Residual stress

Indexed keywords

COARSE-GRAINED MATERIALS; IN-SITU STRESS MEASUREMENT; LINE-PROFILE ANALYSIS; MICRO-STRUCTURE EVOLUTIONS; NANOCRYSTALLINE THIN FILMS; SITU X-RAY DIFFRACTION; THERMO-ELASTIC BEHAVIOR; X-RAY DIFFRACTION MEASUREMENTS;

CRYSTAL DEFECTS; MICROSTRUCTURE; NANOCRYSTALLINE MATERIALS; RESIDUAL STRESSES; TEMPERATURE; THIN FILMS; X RAY DIFFRACTION;

GRAIN GROWTH;

EID: 67650095566     PISSN: 08857156     EISSN: 19457413     Source Type: Journal    
DOI: 10.1154/1.3125550     Document Type: Article

References (23)

1. Bos, C., Sommer, F., and Mittemeijer, E. J. (2007). " Atomistic study on the activation enthalpies for interface mobility and boundary diffusion in an interface-controlled phase transformation.," Philos. Mag. 1478-6435 87, 2245-2262. 10.1080/14786430601156201
2. de Keijser, Th. H., Langford, J. I., Mittemeijer, E. J., and Vogels, A. B. P. (1982). " Use of the Voigt function in a single-line method for the analysis of X-ray diffraction line broadening.," J. Appl. Crystallogr. 0021-8898 15, 308-314. 10.1107/S0021889882012035
3. Delhez, R., de Keijser, Th. H., and Mittemeijer, E. J. (1982). " Determination of crystallite size and lattice distortions through X-ray diffraction line profile analysis," Fresenius'. Z. Anal. Chem. 312, 1-16. 10.1007/BF00482725 0372-7920
4. Divinski, S. V., Lohmann, M., Surholt, T., and Herzig, Chr. (2001). " Grain boundary motion during Ag and Cu grain boundary diffusion in Cu polycrystals.," Interface Sci. 0927-7056 9, 357-363. 10.1023/A: 1015187501784
5. Doerner, M. F. and Nix, W. D. (1988). " Stresses and deformation processes in thin films on substrates.," Crit. Rev. Solid State Mater. Sci. 1040-8436 14, 225-268. 10.1080/10408438808243734
6. Estrin, Y., Gottstein, G., Rabkin, E., and Shvindlerman, L. S. (2001). " Grain growth in thin metallic films.," Acta Mater. 1359-6454 49, 673-681. 10.1016/S1359-6454(00)00344-X
7. Gale, W. F. and Totemeier, T. C. (2004). Smithells Metals Reference Book (Elsevier, Amsterdam), pp. 15(5)-15(6).
8. Gottstein, G., Molodov, D. A., and Shvindlerman, L. S. (2006). " Kinematics, dynamics, and microstructural effects of grain boundary junctions.," J. Mater. Sci. 0022-2461 41, 7730-7740. 10.1007/s10853-006- 0736-x
9. Hansen, K. and Pantleon, K. (2008). " Microstructure stability of silver electrodeposits at room temperature.," Scr. Mater. 1359-6462 58, 96-98. 10.1016/j.scriptamat.2007.09.033
10. Janssen, G. C. A. M. (2007). " Stress and strain in polycrystalline thin films.," Thin Solid Films 0040-6090 515, 6654-6664. 10.1016/j.tsf.2007.03.007
11. Krill, C. E., Helfen, L., Michels, D., Natter, H., Fitch, A., Masson, O., and Birringer, R. (2001). " Size-dependent grain-growth kinetics observed in nanocrystalline Fe.," Phys. Rev. Lett. 0031-9007 86, 842-845. 10.1103/PhysRevLett.86.842
12. Kuru, Y., Wohlschlögel, M., Welzel, U., and Mittemeijer, E. J. (2008). " Non-ambient X-ray diffraction residual stress analysis of thin films: tracing nanosize-related effects on thermoelastic constants and identifying sources of residual stresses.," J. Appl. Crystallogr. 0021-8898 41, 428-435. 10.1107/S0021889808004792
13. Liu, F., Sommer, F., Bos, C., and Mittemeijer, E. J. (2007). " Analysis of solid state phase transformation kinetics: models and recipes.," Int. Mater. Rev. 0950-6608 52, 193-212. 10.1179/174328007X160308
14. Machlin, E. S. (1998). Materials Science in Microelectronics II: The Effects of Structure on Properties in Thin Films (Giro Press, New York), pp. 13-64.
15. Mittemeijer, E. J. and Scardi, P. (2004). Diffraction Analysis of the Microstructure of Materials (Springer, Berlin), pp. 1-13.
16. Pantleon, K. and Somers, M. A. J. (2006). " In situ investigation of the microstructure evolution in nanocrystalline copper electrodeposits at room temperature.," J. Appl. Phys. 0021-8979 100, 114319-1-114319-7. 10.1063/1.2401647
17. Ramaswamy, V., Nix, W. D., and Clemens, B. M. (2004). " Coherency and surface stress effects in metal multilayers.," Scr. Mater. 1359-6462 50, 711-715. 10.1016/j.scriptamat.2003.11.037
18. Sonneveld, E. J., Delhez, R., de Keijser, Th. H., and Mittemeijer, E. J. (1991). " Quality of unraveling of experimental diffraction patterns with artificially varied overlap.," Mater. Sci. Forum 0255-5476 79-82, 85-90. 10.4028/www.scientific.net/MSF.79-82.85
19. Sonnweber-Ribic, P., Gruber, P., Dehm, G., and Arzt, E. (2006). " Texture transition in Cu thin films: Electron backscatter diffraction vs. X-ray diffraction.," Acta Mater. 1359-6454 54, 3863-3870. 10.1016/j.actamat.2006. 03.057
20. Thompson, C. V. and Carel, R. (1996). " Stress and grain growth in thin films.," J. Mech. Phys. Solids 0022-5096 44, 657-673. 10.1016/0022-5096(96)00022-1
21. Welzel, U., Ligot, J., Lamparter, P., Vermeulen, A. C., and Mittemeijer, E. J. (2005). " Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction.," J. Appl. Crystallogr. 0021-8898 38, 1-29. 10.1107/S0021889804029516
22. Windischmann, H. (1992). " Intrinsic stress in sputter-deposited thin films.," Crit. Rev. Solid State Mater. Sci. 1040-8436 17, 547-596. 10.1080/10408439208244586 (Pubitemid 23631062)
23. Wohlschlögel, M., Welzel, U., Maier, G., and Mittemeijer, E. J. (2006). " Calibration of a heating/cooling chamber for X-ray diffraction measurements of mechanical stress and crystallographic texture.," J. Appl. Crystallogr. 0021-8898 39, 194-201. 10.1107/S0021889806000513