Economics modeling of multichip modules testing strategies

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 4, 1998, Pages 360-370

  Abadir, Magdy ^a,b  

^a IEEE   (United States)

^b MOTOROLA INC   (United States)

Author keywords

Cost models; Multichip modules (MCM); Multichip systems; Test economics; Test strategies; Tradeoff analysis

Indexed keywords

BUILT-IN SELF TEST; COST EFFECTIVENESS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; MULTICHIP MODULES;

DESIGN FOR TEST (DFT);

ELECTRONICS PACKAGING;

EID: 0032202462     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.730420     Document Type: Article

References (14)

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