Investigation and a practical compact network model of thermal stress in integrated circuits

Integrated Computer-Aided Engineering

Volumn 16, Issue 2, 2009, Pages 131-140

  Krishnamoorthy, Shriram ^a   Chowdhury, Masud H ^a  

^a University of Illinois   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADJACENT NODES; BOUNDARY NODES; CAD TOOL; COMPACT THERMAL MODELING; COMPLEX NATURE; DETAILED MODELS; DISCRETE MODELS; ENGINEERING PROBLEMS; HEAT SOURCES; IC PACKAGE; INTERNAL NODES; MATRIX; NETWORK MODELS; NETWORK-BASED; NONUNIFORM; PHYSICAL REGION; REDUCED SYSTEMS; RESISTIVE NETWORK; SPATIAL DISCRETIZATION; SUB-100 NM; SURFACE NODES; SYSTEM LEVEL SIMULATION; SYSTEM MATRICES; THERMAL DISTRIBUTIONS;

AIRCRAFT ENGINES; ANALOG DIFFERENTIAL ANALYZERS; COMPUTER AIDED DESIGN; INTEGRATED CIRCUITS; ORDINARY DIFFERENTIAL EQUATIONS; PARTIAL DIFFERENTIAL EQUATIONS; SET THEORY; STRENGTH OF MATERIALS; THERMAL STRESS; THERMOELASTICITY;

SIMULATORS;

EID: 67649407471     PISSN: 10692509     EISSN: None     Source Type: Journal    
DOI: 10.3233/ICA-2009-0310     Document Type: Article

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