Bridging the gap: Package level and system level thermal modeling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 287-293

  Wang, W ^a   Liou, S ^a   Sun, Y S ^a   Lai, J Y ^b   Tien, C ^b   Her, T D ^b   Michael, M ^c  

^a NEC Corporation of America   (United States)

^b SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

^c NVIDIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; DATA STORAGE EQUIPMENT; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; TEMPERATURE;

BALL GRID ARRAY; CHIP JUNCTION TEMPERATURE;

ELECTRONICS PACKAGING;

EID: 0034480149     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)