Thermal characterization of electronic parts with compact models: interpretation, application, and the need for a paradigm shift

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 40-48

  Lasance, Clemens J M ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SOFTWARE; ELECTRIC RESISTANCE; HEAT RESISTANCE; MATHEMATICAL MODELS; THERMOANALYSIS;

COMPACT MODELS; ELECTRONIC PARTS; THERMAL CHARACTERIZATION;

ELECTRONIC EQUIPMENT;

EID: 0030822315     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)