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Volumn 19, Issue 5, 2009, Pages 326-328

A 1 v 23 GHz low-Noise amplifier in 45 nm planar bulk-CMOS technology with high-Q above-IC inductors

Author keywords

45 nm; CMOS; Electrostatic discharge (ESD) protection; K band; Low noise amplifier (LNA)

Indexed keywords

45 NM; CMOS; ELECTROSTATIC DISCHARGE (ESD) PROTECTION; K -BAND; LOW-NOISE AMPLIFIER (LNA);

EID: 67649277695     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2009.2017611     Document Type: Article
Times cited : (16)

References (11)
  • 2
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    • An 800-μW 26-GHz CMOS tuned amplifier
    • Y. Su and K. K. O, "An 800-μW 26-GHz CMOS tuned amplifier," in Proc. IEEE RFIC Symp., 2006, pp. 151-154.
    • (2006) Proc. IEEE RFIC Symp , pp. 151-154
    • Su, Y.1    O, K.K.2
  • 5
    • 33749508620 scopus 로고    scopus 로고
    • A 20 GHz sub-1 V low noise amplifier and a resistive mixer in 90 nm CMOS technology
    • M. Bao, H. Jacobsson, L. Aspemyr, A. Mercha, and G. Carchon, "A 20 GHz sub-1 V low noise amplifier and a resistive mixer in 90 nm CMOS technology," in Proc. APMC, 2005, vol. 5, pp. 3326-3329.
    • (2005) Proc. APMC , vol.5 , pp. 3326-3329
    • Bao, M.1    Jacobsson, H.2    Aspemyr, L.3    Mercha, A.4    Carchon, G.5
  • 6
    • 23844543104 scopus 로고    scopus 로고
    • A 24-GHz 3.9-dB NF low-noise amplifier using 0.18 μm CMOS technology
    • Jul
    • S.-C. Shin, M.-D. Tsai, R.-C. Liu, K.-Y. Lin, and H. Wang, "A 24-GHz 3.9-dB NF low-noise amplifier using 0.18 μm CMOS technology," IEEE Microw. Wireless Compon. Lett., vol. 15, no. 7, pp. 448-450, Jul. 2005.
    • (2005) IEEE Microw. Wireless Compon. Lett , vol.15 , Issue.7 , pp. 448-450
    • Shin, S.-C.1    Tsai, M.-D.2    Liu, R.-C.3    Lin, K.-Y.4    Wang, H.5
  • 8
    • 27844546722 scopus 로고    scopus 로고
    • A power efficient differential 20-GHz low noise amplifier with 5.3-GHz 3-dB bandwidth
    • Sep
    • X. Guo and K. K. O, "A power efficient differential 20-GHz low noise amplifier with 5.3-GHz 3-dB bandwidth," IEEE Microw. Wireless Compon. Lett., vol. 15, no. 9, pp. 603-605, Sep. 2005.
    • (2005) IEEE Microw. Wireless Compon. Lett , vol.15 , Issue.9 , pp. 603-605
    • Guo, X.1    O, K.K.2
  • 10
    • 2442669253 scopus 로고    scopus 로고
    • Wafer-level packaging technology for high-Q on-chip inductors and transmission lines
    • Apr
    • G. Carchon, W. D. Raedt, and E. Beyne, "Wafer-level packaging technology for high-Q on-chip inductors and transmission lines," IEEE Trans. Micww. Theory Tech., vol. 52, no. 4, pp. 1244-1251, Apr. 2004.
    • (2004) IEEE Trans. Micww. Theory Tech , vol.52 , Issue.4 , pp. 1244-1251
    • Carchon, G.1    Raedt, W.D.2    Beyne, E.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.