Megasonic agitation for enhanced electrodeposition of copper

Microsystem Technologies

Volumn 15, Issue 8, 2009, Pages 1245-1254

  Kaufmann, Jens Georg ^a   Desmulliez, Marc P Y ^a   Tian, Yingtao ^b   Price, Dennis ^c   Hughes, Mike ^d   Strusevich, Nadia ^d   Bailey, Chris ^d   Liu, Changqing ^b   Hutt, David ^b  

^a HERIOT WATT UNIVERSITY   (United Kingdom)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^c Merlin Circuit Technology Ltd   (United Kingdom)

^d UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING PROCESS; FLIP CHIP BUMPS; HIGH ASPECT RATIO; MEGASONIC; MEGASONIC AGITATION; METAL DEPOSIT; METALLISATION; MICROVIAS; MULTI-PHYSICS; NERNST DIFFUSION LAYER; NUMERICAL SIMULATION; PLATING RATES; ULTRA FINE PITCH;

ACOUSTIC STREAMING; ASPECT RATIO; FLUID DYNAMICS; PHOTORESISTS;

ACOUSTICS;

EID: 67649216546     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0886-2     Document Type: Conference Paper

References (11)

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