Limits of copper plating in high aspect ratio microvias

Circuit World

Volumn 25, Issue 2, 1999, Pages 35-40

  Castaldi, Steve ^a   Fritz, Dennis ^a   Schaeffer, Ron ^b  

^a MacDermid Incorporated   (United States)

^b PhotoMachining Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DEPOSITION; DIELECTRIC MATERIALS; ELECTROPLATING; LASER APPLICATIONS; MULTILAYERS; PRINTED CIRCUIT BOARDS;

ELECTROLESS COPPER DEPOSITION; MICROVIAS; MULTILAYER BOARDS;

COPPER PLATING;

EID: 0033300922     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129910258324     Document Type: Article

References (2)

1. Durso, F., Castaldi, S. and Fritz, D. (1997), "Plated conductor characteristics: microvias made by laser ablation of screen printed dielectric", IPC Expo.
2. Schaeffer, R.D. (1997), Laser Micromachining: High Speed Hole Drilling for Electronics Packaging, JPCA.