|
Volumn 41, Issue 5, 2009, Pages 440-444
|
Interface characterization of nickel contacts to bulk bismuth tellurium selenide
|
Author keywords
Electron energy loss spectroscopy; Focused ion beam; Thermoelectric materials; Transmission electron microscopy; X ray diffraction
|
Indexed keywords
AFTER-HEAT TREATMENT;
ANALYTICAL ELECTRON MICROSCOPY;
BISMUTH TELLURIDE;
EXPOSURE TIME;
FIB/SEM;
INTERFACE CHARACTERIZATION;
INTERFACIAL REGION;
ION BEAM ENERGY;
LIFT-OUT TECHNIQUES;
SELECTED AREA DIFFRACTION PATTERNS;
SELENIDE;
TEM;
THERMOELECTRIC MATERIALS;
BISMUTH;
DIFFRACTION;
DISSOCIATION;
ELECTRON EMISSION;
ELECTRON ENERGY LEVELS;
ELECTRON MICROSCOPES;
ELECTRON SCATTERING;
ELECTRONS;
ENERGY DISSIPATION;
FOCUSED ION BEAMS;
HOLOGRAPHIC INTERFEROMETRY;
IONS;
NICKEL;
NICKEL ALLOYS;
NUCLEAR INSTRUMENTATION;
SOLID ELECTROLYTES;
TELLURIUM;
TELLURIUM COMPOUNDS;
THERMOELECTRIC EQUIPMENT;
THERMOELECTRICITY;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION;
ELECTRON ENERGY LOSS SPECTROSCOPY;
|
EID: 67649195077
PISSN: 01422421
EISSN: 10969918
Source Type: Journal
DOI: 10.1002/sia.3046 Document Type: Article |
Times cited : (51)
|
References (10)
|