Films of Ni-7 at% V, Pd, Pt and Ta-Si-N as diffusion barriers for copper on Bi2Te3

Journal of Physics D: Applied Physics

Volumn 31, Issue 19, 1998, Pages 2406-2411

  Kacsich, T ^a   Kolawa, E ^b   Fleurial, J P ^b   Caillat, T ^b   Nicolet, M A ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BACKSCATTERING; INTERDIFFUSION (SOLIDS); MAGNETRON SPUTTERING; X RAY DIFFRACTION;

BACKSCATTERING SPECTROMETRY; DIFFUSION BARRIERS;

THIN FILMS;

EID: 0032494312     PISSN: 00223727     EISSN: None     Source Type: Journal    
DOI: 10.1088/0022-3727/31/19/007     Document Type: Article

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