A stiff and flat membrane operated DC contact type RF MEMS switch with low actuation voltage

Sensors and Actuators, A: Physical

Volumn 153, Issue 1, 2009, Pages 114-119

  Kim, Jongseok ^a,b   Kwon, Sangwook ^a   Jeong, Heemoon ^a   Hong, Youngtack ^a   Lee, Sanghun ^a   Song, Insang ^a   Ju, Byeongkwon ^b  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^b Korea University   (South Korea)

Author keywords

RF switch; Stiff membrane; Variable seesaw

Indexed keywords

ACTUATION MECHANISM; ACTUATION VOLTAGES; DC CONTACT; ELECTROSTATIC ACTUATION; FABRICATION METHOD; FLAT MEMBRANE; HIGH VOLTAGE; INTERNAL STRESS; LOW ACTUATION VOLTAGE; LOW VOLTAGES; LOW-POWER CONSUMPTION; OPERATION VOLTAGE; RF CHARACTERISTICS; RF SWITCH; RF-MEMS SWITCHES; STIFF MEMBRANE; SWITCH OPERATION; VARIABLE SEESAW;

ELECTRIC SWITCHES; ELECTROSTATIC ACTUATORS; ELECTROSTATICS; MEMS; MICROELECTROMECHANICAL DEVICES;

MEMBRANES;

EID: 67349259299     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.04.002     Document Type: Article

References (16)

1. Peng B., Zhang W.L., Chen G.H., Zhang W.X., and Jiang H.C. Modeling microwave behaviors of series cantilever MEMS switch. Sensors and Actuators A 125 2 (2006) 471-476
2. Centiner B.A., Qian J.Y., Chang H.P., Bachman M., Li G.P., and Flaviis F.D. Monolithic integration of RF MEMS switches with a diversity antenna on PCB substrate. IEEE Transaction on Microwave Theory and Techniques 51 1 (2003) 332-335
3. Goldsmith C.L., Yao Z., Eshelman S., and Denniston D. Performance of low loss RF MEMS capacitive switches. IEEE Microwave and Guided Wave Letters 8 8 (1998) 269-271
4. Yamazaki H., Ikehashi T., Ohguro T., Ogawa E., Kojima K., Ishimaru K., and Ishiuchi H. An intelligent bipolar actuation method with high stiction immunity for RF MEMS capacitive switches and variable capacitors. Sensors and Actuators A 139 1-2 (2007) 233-236
5. Yao Z.J., Chen S., Edelshen S., and Goldsmith C. Micromachined low loss Microwave Switches. IEEE Journal of Microelectro Mechanical Systems 8 2 (1999) 129-134
6. Muldavin J.B., and Rebeiz G.M. High isolation CPW MEMS shunt switches. Part 2. Design. IEEE Transactions on Microwave Theory and Techniques 48 6 (2000) 1053-1056
7. Rangra K., Margesin B., Lorenzelli L., Giacomozzi F., Collini C., Zen M., Soncini G., Tin L., and Gaddi R. Symmetric toggle switch - a new type of RF MEMS switch for telecommunication applications: design and fabrication. Sensors and Actuators A 123-124 (2005) 505-514
8. Seki T., Uno Y., Narise K., Masuda T., Inoue K., Sato S., Sato F., Imanaka K., and Sugiyama S. Development of a large-force low loss metal contact RF MEMS switch. Sensors and Actuators A 132 2 (2006) 683-688
9. Rebeiz G.M. RF MEMS: Theory, Design and Technology (2003), John Wiley & Sons, Inc., New Jersey, USA
10. Kim J.S. Fabrication of flat RF MEMS switch membrane by minimizing of stress gradients in the Au membrane structure. MRS Fall Meeting Proceedings 741 (2002) 87-91
11. Strawser R.E., Leedy K.D., Cortez R., Ebel J.L., Dooley S.R., Abell C.F.H., and Bright V.M. Influence of metal stress on RF MEMS capacitive switches. Sensors and Actuators A 134 2 (2007) 600-605
12. Popov E.P. Introduction to Mechanics of Solids (1968), Prentice-Hall, New Jersey, USA
13. Shigley J.E., and Mitchell L.D. Mechanical Engineering Design (1983), McGraw-Hill, USA
14. Go J.S., and Cho Y.H. Experimental evaluation of anodic bonding process based on the Taguchi analysis of interfacial fracture toughness. Sensors and Actuators A 73 1-2 (1999) 52-57
15. Lucic S.T., Ames J., Boardman B., McIntyre D., Jaramillo P., Starr L., and Lim M.H. Bond quality characterization of silicon-glass anodic bonding. Sensors and Actuators A 60 1-3 (1997) 223-227
16. Goldsmith C., Ehmke J., Malczewski A., Pillans B., Eshelman S., Yao Z., Brank J., and Eberly M. Lifetime characterization of capacitive RF MEMS switches. IEEE MTT-S International Microwave Symposium, 1 (2001) 227-230