Surface evolution during the chemical mechanical planarization of copper

CIRP Annals - Manufacturing Technology

Volumn 55, Issue 1, 2006, Pages 605-608

  Che, W ^a   Bastawros, A ^b   Chandra, A ^b  

^a Saint Gobain Inc   (United States)

^b Iowa State University   (United States)

Author keywords

Nano indentation; Polishing; Surface

Indexed keywords

ETCHING; RESIDUAL STRESSES; STRESS ANALYSIS; SURFACE PHENOMENA; SURFACE ROUGHNESS;

CHEMICAL ETCHING; CHEMICAL MECHANICAL PLANARIZATION (CMP); PLANARIZATION RATE; STRESSED SURFACES;

COPPER;

EID: 33750068316     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60493-4     Document Type: Article

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