Effect of surface treatments on interfacial adhesion energy between UV-curable resist and glass wafer

International Journal of Adhesion and Adhesives

Volumn 29, Issue 6, 2009, Pages 662-669

  Jang, Eun Jung ^a   Park, Young Bae ^a   Lee, Hak Joo ^b   Choi, Dae Geun ^b   Jeong, Jun Ho ^b   Lee, Eung Sug ^b   Hyun, Seungmin ^b  

^a Andong National University   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

Interfacial adhesion energy; Nanoimprint lithography; Self assembled monolayer; Surface treatment

Indexed keywords

ADHESION PROMOTERS; ADHESION PROPERTIES; ANTI-STICKING LAYERS; FIELD EMISSION-SCANNING ELECTRON MICROSCOPIES; FOUR-POINT BENDING TESTS; FRACTURE MODES; GLASS WAFERS; INTERFACIAL ADHESION ENERGY; INTERFACIAL FRACTURE ENERGIES; INTERFACIAL FRACTURES; NANO IMPRINTINGS; OXYGEN PLASMAS; RESIST COATINGS; SELF-ASSEMBLED MONOLAYER; SILICA SUBSTRATES; UV-CURABLE; VARIOUS SUBSTRATES; X-RAY PHOTOELECTRON SPECTROSCOPIES;

ADHESION; BENDING (FORMING); CURING; EMISSION SPECTROSCOPY; FIELD EMISSION; FIELD EMISSION MICROSCOPES; FRACTURE; GLASS; NANOIMPRINT LITHOGRAPHY; OXYGEN; SCANNING ELECTRON MICROSCOPY; SELF ASSEMBLED MONOLAYERS; SILICA; SUBSTRATES; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERFACIAL ENERGY;

EID: 67349143989     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2009.02.006     Document Type: Article

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