Fabrication and electrical properties of laser-shaped thick-film and LTCC microresistors

Microelectronics Reliability

Volumn 49, Issue 6, 2009, Pages 600-606

  Nowak, Damian ^a   Miś, Edward ^a   Dziedzic, Andrzej ^a   Kita, Jarosław ^b  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b UNIVERSITY OF BAYREUTH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL PROPERTIES; ELECTRICAL PULSE; FABRICATION METHODS; GEOMETRICAL DIMENSIONS; GEOMETRICAL PROPERTIES; LASER SHAPING; LONG-TERM STABILITIES; LTCC TECHNOLOGIES; MICRO RESISTORS; STABILITY PROPERTIES; SYSTEMATIC STUDIES; TEMPERATURE COEFFICIENT OF RESISTANCES; TEST STRUCTURES; THICK-FILM; TWO-RESISTORS;

ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; FABRICATION; MINIATURE INSTRUMENTS; RESISTORS; STABILITY;

LASERS;

EID: 67349135687     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.02.019     Document Type: Article

References (17)

1. Dziedzic A. Electrical and structural investigations in reliability characterisation of modern passives and passive integrated components. Microelectron Reliab 42 (2002) 709-719
2. In: Ulrich R.K., and Schaper L.W. (Eds). Integrated passive component technology (2003), Wiley Interscience
3. Dziedzic A. Modern micropassives: fabrication and electrical properties. Bull Pol Ac Sci: Technical Sci 54 (2006) 9-18
4. Minalgiene J, Baltrusaitis V. Photoimageable thick film implementation of very high density ceramics technology products. In: Proc 39th IMAPS Nordic annual conf, Stockholm; September 2002. p. 233-42.
5. Dziedzic A., Rebenklau L., Golonka L.J., and Wolter K.J. Fodel microresistors - processing and basic electrical properties. Microelectron Reliab 43 (2003) 377-383
6. Dziedzic A., Mis E., Rebenklau L., and Wolter K.J. Geometrical and electrical properties of LTCC and thick-film microresistors. Microelectron Int 22 1 (2005) 26-33
7. Henke M, Bauer R, Golonka LJ, Rebenklau R, Dziedzic A, Wolter KJ. Investigations on LTCC-multilayer with high density pattern and cofired resistors. In: Proc 22nd int spring seminar on electronics technology, Dresden, Germany; May 1999. p. 105-10.
8. Bauer R, Dziedzic A, Golonka L, Wolter KJ. Investigation for miniaturization of thick film resistors by application of a postpatterning thick film system. In: Proc 1st Eur microelectronics and packaging symp, Prague; 2000. p. 134-9.
9. Lakeman C., and Fleig P. High resolution integration of passives using micro-contact printing (μCP). Microelectron Int 20 1 (2003) 52-55
10. Mis E., and Dziedzic A. Multiterminal thick-film and LTCC microresistors - contact effect simulation and trimming procedure consideration. Elektronika 47 12 (2006) 16-18
11. Kita J, Dziedzic A, Golonka LJ. Non-conventional application of laser in LTCC and thick-film technology - preliminary results. In: Proc 23rd int spring seminar on electronics technology, Balatonfured, Hungary; May 2000. p. 219-24.
12. Illyefalvi-Viteez Z. Laser processing for microelectronics packaging applications. Microelectron Reliab 41 (2001) 563-570
13. Drue KH. Precise drilling and structuring of LTCC materials using a 355 nm YAG-laser. In: Proc EMPC 2005, Brugge; June 2005. p. 410-5.
14. Mis E, Borucki M, Dziedzic A, Kamiński S, Rebenklau L, Wolter KJ, et al. "Laser-shaped thick-film and LTCC microresistors". In: ESTC 2006, Dresden; 2006. p. 954-60.
15. Dziedzic A., Kolek A., Ehrhardt A., and Thust H. Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors. Microelectron Reliab 46 (2006) 352-359
16. Tobita T., and Takasago H. New trimming technique for a thick film resistor by the pulse voltage method. IEEE Trans CHMT 14 (1991) 613-617
17. Dziedzic A, Golonka LJ, Kita J, Roguszczak H, Zdanowicz T. Some remarks about "short" pulse behaviour of LTCC and thick-film microsystems. In: Proc 1st Eur microelectronics and packaging symp, Prague, Czech Republic; June 2000. p. 194-9.