Precise drilling and structuring of LTCC materials using a 355 nm YAG-laser

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 410-415

  Drüe, Karl Heinz ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Cavity; Laser; LTCC; Microvia; RF

Indexed keywords

COMPUTER AIDED DESIGN; LASERS; MICROELECTRONICS; YTTRIUM ALUMINUM GARNET;

CAVITY; DIFFERENT SHAPES; DIFFERENT THICKNESS; GLASS PARTICLES; LTCC; MICROVIAS; SPECIAL APPLICATIONS; STANDARD TECHNOLOGY;

INFILL DRILLING;

EID: 84879869398     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. K.-H. Drüe, T. Thelemann, H. Thust "Laser Processing of LTCC with different machine concepts", 14th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, Germany, 23-25 June 2003 pp. 248-253
2. R. Perrone, H. Thust, K.-H. Drüe "Progress in the Integration of planar and 3D Coils by using photoimageable Inks", 2004 International Symposium on Microelectronics, 14-18 November 2004, Long Beach, CA
3. E. Elvey, G. Wang, F. Barlow, A. Elshabini "Micro Vias in LTCC Substrates", 2004 International Symposium on Microelectronics, 14-18 November 2004, Long Beach, CA
4. S. Rentsch, Breitbandige HF-Anschlüsse an LTCC-Gehäuse, dissertation (Dipl.-Ing. degree), TU Ilmenau, 2004