High-resolution integration of passives using micro-contact printing (μCP)

Microelectronics International

Volumn 20, Issue 1, 2003, Pages 52-55+8

  Lakeman, Charles D E ^a   Fleig, Patrick F ^a  

^a TPL Incorporated   (United States)

Author keywords

Electrical circuits; Printed circuit boards

Indexed keywords

EID: 0037278793     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360310455544     Document Type: Article

References (2)