Effects of high uniform magnetic fields on diffusion behavior at the Cu/Al solid/liquid interface

Scripta Materialia

Volumn 56, Issue 6, 2007, Pages 485-488

  Wang, Qiang ^a   Li, Dong gang ^a   Wang, Kai ^a   Wang, Zhong ying ^a   He, Ji cheng ^a  

^a NORTHEASTERN UNIVERSITY   (China)

Author keywords

Convection; Electromagnetic processing of materials; High magnetic fields; Interface diffusion; Liquid infiltration

Indexed keywords

ALUMINUM; COPPER; DIFFUSION; HEAT CONVECTION; MAGNETIC FIELD EFFECTS; MAGNETOELECTRIC EFFECTS;

CONVECTION; ELECTROMAGNETIC PROCESSING OF MATERIALS; HIGH MAGNETIC FIELDS; INTERFACE DIFFUSION; LIQUID INFILTRATION;

PHASE INTERFACES;

EID: 33846070675     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.11.026     Document Type: Article

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