Peculiarities and thermal stability of microstructure and strength properties of Ti-Al-Si-O-C-N films

Russian Physics Journal

Volumn 51, Issue 11, 2008, Pages 1178-1187

  Korotaev, A D ^a   Borisov, D P ^b   Moshkov, V Yu ^a   Ovchinnikov, S V ^a   Pinzhin, Yu P ^a,c   Savostikov, V M ^b   Tyumentsev, A N ^a,c  

^a TOMSK STATE UNIVERSITY   (Russian Federation)

^b TECKNOTRON State Organization   (Russian Federation)

^c INSTITUTE OF STRENGTH PHYSICS AND MATERIALS SCIENCE   (Russian Federation)

Author keywords

Dislocation substructure; Microhardness; Nanocomposite films; Thermal stability; Ti Al Si N; X ray amorphous phase

Indexed keywords

EID: 67349092156     PISSN: 10648887     EISSN: 15739228     Source Type: Journal    
DOI: 10.1007/s11182-009-9171-1     Document Type: Article

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