Backside observation of large-scale integrated circuits with multilayered interconnections using laser terahertz emission microscope

Applied Physics Letters

Volumn 94, Issue 19, 2009, Pages

  Yamashita, Masatsugu ^a   Otani, Chiko ^a   Kawase, Kodo ^a,b   Matsumoto, Toru ^c   Nikawa, Kiyoshi ^d   Kim, Sunmi ^e   Murakami, Hironaru ^e   Tonouchi, Masayoshi ^e  

^a RIKEN   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

^c CENTRAL RESEARCH LABORATORY   (Japan)

^d RENESAS TECHNOLOGY CORP   (Japan)

^e OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL FAILURES; EXCITATION LASERS; INTERCONNECTION STRUCTURE; LASER TERAHERTZ EMISSION MICROSCOPE; MULTI-LAYERED; SCALE INTEGRATED CIRCUITS; TERAHERTZ EMISSIONS;

LASER EXCITATION; LASERS; PULSED LASER APPLICATIONS;

INTEGRATED CIRCUITS;

EID: 67049172547     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3133346     Document Type: Article

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