A low-power oven-controlled vacuum package technology for high-performance MEMS

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2009, Pages 753-756

  Lee, S H ^a   Cho, J ^a   Lee, S W ^a   Zaman, M F ^b   Ayazi, F ^b   Najafil, K ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLAN VARIANCE; BIAS INSTABILITY; CONSTANT TEMPERATURE; CONTROL APPROACH; CONTROLLED STRUCTURES; ENVIRONMENT TEMPERATURE; GLASS WAFER; ISOLATION PLATFORM; LOW POWER; LOW-POWER CONSUMPTION; MEMSDEVICES; PIRANI GAUGE; RADIATION SHIELD; RANDOM WALK; THERMAL ENVIRONMENT; TUNING FORK GYROSCOPES; VACUUM PACKAGE; VACUUM PACKAGING; VACUUM PRESSURE; VIBRATION ISOLATIONS;

MEMS; MICROELECTROMECHANICAL DEVICES; STOVES; VACUUM;

OVENS;

EID: 65949109501     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2009.4805492     Document Type: Conference Paper

References (5)

1. K. Najafi, "Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS," Proceedings of SPIE, vol. 4979, pp. 1-19, 2003.
2. S. -H. Lee, S. W. Lee, and K. Najafi, "A Generic Environment-Resistant Packaging Technology for MEMS," in Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007, Jun 2007, pp. 335-338.
3. S. W. Yoon, S. Lee, N. C. Perkins, and K. Najafi, "Shock Protection Using Soft Coating as Shock Stops," in Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, South Carolina, Jun 2006, pp. 396-399.
4. J. Mitchell, G. R. Lahiji, and K. Najafi, "Long-term Reliability, Bum-in and Analysis of Outgassing in Au-Si Eutectic Wafer-level Vacuum Packages," in Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, South Carolina, Jun 2006, pp. 376-379.
5. A. Sharma, M. F. Zaman, M. Zucher, and F. Ayazi, "A 0.1°/hr Bias Drift Electrically Matched Tuning Fork Microgyroscope," in IEEE 21st International Conference on Micro Electro Mechanical Systems, 2008. MEMS 2008, Jan 2008, pp. 6-9.