A generic environment-resistant packaging technology for MEMS

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 335-338

  Lee, S H ^a   Lee, S W ^a   Najafi, K ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Flip chip transfer; MEMS packaging; Thermal and vibration isolation; Wafer bonding

Indexed keywords

ACTUATORS; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; DIES; ELECTRONIC EQUIPMENT MANUFACTURE; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; NONMETALS; OPTICAL DESIGN; SENSORS; SILICON; SILICON WAFERS; TECHNOLOGY; TECHNOLOGY TRANSFER; TRANSDUCERS;

CONTACT-RESISTANCE; FEEDTHROUGH; FLIP CHIP TRANSFER; GENERIC ENVIRONMENT; GLASS WAFERS; INTEGRATED FASHION; INTERNATIONAL CONFERENCES; MEMS CHIPS; MEMS DEVICES; MEMS PACKAGING; PACKAGING TECHNOLOGIES; SIGNAL TRANSFER; SILICON DIES; SOLID-STATE SENSORS; SUSPENSION BEAMS; THERMAL AND VIBRATION ISOLATION; VERTICAL FEEDTHROUGHS; VIBRATION ISOLATIONS; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 42549155849     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300136     Document Type: Conference Paper

References (4)

1. K. Najafi, "Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS," Proceedings of SPIE, vol. 4979, p. 1, 2003.
2. S. W. Yoon, S. Lee, N. C. Perkins, and K. Najafi, "Shock Protection Using Soft Coating as Shock Stops," in Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head Island, South Carolina, 2006, pp. 396-399.
3. J. Mitchell, G. R. Lahiji, and K. Najafi, "Long-term Reliability, Burn-in and Analysis of Outgassing in Au-Si Eutectic Wafer-level Vacuum Packages," in Tech. Dig. Solid- State Sensors, Actuators, and Microsystems Workshop, Hilton Head Island, SC, Jun 2006, pp. 376-379.
4. W. Welch III, J. Chae, S.-H. Lee, N. Yazdi, and K. Najafi, "Transient Liquid Phase (TLP) Bonding for Microsystem Packaging Applications," Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS'05. The 13th International Conference on, vol. 2, pp. 1350-1353, 2005.