-
1
-
-
33845962528
-
-
10.1063/1.2410241
-
A. Dimoulas, P. Tsipas, A. Sotiropoulos, and E. K. Evangelou, Appl. Phys. Lett., 89, 252110 (2006). 10.1063/1.2410241
-
(2006)
Appl. Phys. Lett.
, vol.89
, pp. 252110
-
-
Dimoulas, A.1
Tsipas, P.2
Sotiropoulos, A.3
Evangelou, E.K.4
-
2
-
-
0344908365
-
-
10.1116/1.584426
-
C. C. Han, E. D. Marshall, F. Fang, L. C. Wang, S. S. Lau, and D. Voreades, J. Vac. Sci. Technol. B, 6, 1662 (1998). 10.1116/1.584426
-
(1998)
J. Vac. Sci. Technol. B
, vol.6
, pp. 1662
-
-
Han, C.C.1
Marshall, E.D.2
Fang, F.3
Wang, L.C.4
Lau, S.S.5
Voreades, D.6
-
3
-
-
25444473447
-
-
10.1016/j.mee.2005.06.004
-
D. Han, Y. Wang, D. Tian, W. Wang, X. Liun, J. Kang, and R. Han, Microelectron. Eng., 82, 93 (2005). 10.1016/j.mee.2005.06.004
-
(2005)
Microelectron. Eng.
, vol.82
, pp. 93
-
-
Han, D.1
Wang, Y.2
Tian, D.3
Wang, W.4
Liun, X.5
Kang, J.6
Han, R.7
-
4
-
-
20544467653
-
-
10.1063/1.1923162
-
D. Z. Chi, R. T. P. Lee, S. J. Chua, S. J. Lee, S. Ashok, and D. L. Kwong, J. Appl. Phys., 97, 113706 (2005). 10.1063/1.1923162
-
(2005)
J. Appl. Phys.
, vol.97
, pp. 113706
-
-
Chi, D.Z.1
Lee, R.T.P.2
Chua, S.J.3
Lee, S.J.4
Ashok, S.5
Kwong, D.L.6
-
5
-
-
33644889343
-
-
10.1016/j.tsf.2005.09.033
-
R. Li, H. B. Yao, S. J. Lee, D. Z. Chi, M. B. Yu, G. Q. Lo, and D. L. Kwong, Thin Solid Films, 504, 28 (2006). 10.1016/j.tsf.2005.09.033
-
(2006)
Thin Solid Films
, vol.504
, pp. 28
-
-
Li, R.1
Yao, H.B.2
Lee, S.J.3
Chi, D.Z.4
Yu, M.B.5
Lo, G.Q.6
Kwong, D.L.7
-
6
-
-
33646154872
-
-
10.1063/1.2191829
-
K. Ikeda, T. Maeda, and S. Takagi, Appl. Phys. Lett., 88, 152115 (2006). 10.1063/1.2191829
-
(2006)
Appl. Phys. Lett.
, vol.88
, pp. 152115
-
-
Ikeda, K.1
Maeda, T.2
Takagi, S.3
-
7
-
-
13444283850
-
-
10.1109/LED.2004.841462
-
S. Zhu, R. Li, S. J. Lee, M. F. Li, A. Du, J. Singh, C. Zhu, A. Chin, and D. L. Kwong, IEEE Electron Device Lett., 26, 81 (2005). 10.1109/LED.2004.841462
-
(2005)
IEEE Electron Device Lett.
, vol.26
, pp. 81
-
-
Zhu, S.1
Li, R.2
Lee, S.J.3
Li, M.F.4
Du, A.5
Singh, J.6
Zhu, C.7
Chin, A.8
Kwong, D.L.9
-
8
-
-
33744759866
-
-
10.1109/LED.2006.874128
-
R. Li, S. J. Lee, H. B. Yao, D. Z. Chi, M. B. Yu, and D. L. Kwong, IEEE Electron Device Lett., 27, 476 (2006). 10.1109/LED.2006.874128
-
(2006)
IEEE Electron Device Lett.
, vol.27
, pp. 476
-
-
Li, R.1
Lee, S.J.2
Yao, H.B.3
Chi, D.Z.4
Yu, M.B.5
Kwong, D.L.6
-
9
-
-
38349119448
-
-
10.1063/1.2831918
-
R. R. Lieten, S. Degroote, M. Kuijk, and G. Borghs, Appl. Phys. Lett., 92, 022106 (2008). 10.1063/1.2831918
-
(2008)
Appl. Phys. Lett.
, vol.92
, pp. 022106
-
-
Lieten, R.R.1
Degroote, S.2
Kuijk, M.3
Borghs, G.4
-
11
-
-
65949101206
-
-
in, K. D. Hobart, S. Bengtsson, H. Baumgart, T. Suga, and C. E. Hunt, Editors, PV 2005-2, The Electrochemical Society Proceedings Series, Pennington, NJ.
-
C. Deguet, J. Dechamp, C. Morales, A. M. Charvet, L. Clavelier, V. Loup, J. M. Hartmann, M. Kernevez, Y. Campidelli, F. Allibert, in Semiconductor Wafer Bonding VIII: Science, Technology, and Applications, K. D. Hobart, S. Bengtsson, H. Baumgart, T. Suga, and, C. E. Hunt, Editors, PV 2005-2, p. 78, The Electrochemical Society Proceedings Series, Pennington, NJ, (2005).
-
(2005)
Semiconductor Wafer Bonding VIII: Science, Technology, and Applications
, pp. 78
-
-
Deguet, C.1
Dechamp, J.2
Morales, C.3
Charvet, A.M.4
Clavelier, L.5
Loup, V.6
Hartmann, J.M.7
Kernevez, M.8
Campidelli, Y.9
Allibert, F.10
-
12
-
-
65949089356
-
-
In press. [DOI: 10.1016/j.mss2008.11.008]
-
L. Hutin, S. Koffel, C. Le Royer, L. Clavelier, P. Scheiblin, V. Mazzocchi, and S. Deleonibus, Mater. Sci. Semicond. Process., In press. [DOI: 10.1016/j.mssp.2008.11.008]
-
Mater. Sci. Semicond. Process.
-
-
Hutin, L.1
Koffel, S.2
Le Royer, C.3
Clavelier, L.4
Scheiblin, P.5
Mazzocchi, V.6
Deleonibus, S.7
-
13
-
-
0012662516
-
-
O. A. Golikova, B. Y. Moizhes, and L. S. Stil'Bans, Sov. Phys. Solid State, 3, 2259 (1962).
-
(1962)
Sov. Phys. Solid State
, vol.3
, pp. 2259
-
-
Golikova, O.A.1
Moizhes, B.Y.2
Stil'Bans, L.S.3
-
14
-
-
1642493790
-
-
V. I. Fistul, M. I. Iglitsyn, and E. M. Omel'yanovskii, Sov. Phys. Solid State, 4, 784 (1962).
-
(1962)
Sov. Phys. Solid State
, vol.4
, pp. 784
-
-
Fistul, V.I.1
Iglitsyn, M.I.2
Omel'Yanovskii, E.M.3
-
15
-
-
0015328798
-
-
10.1149/1.2404240
-
J. Berger, J. Electrochem. Soc., 119, 507 (1972). 10.1149/1.2404240
-
(1972)
J. Electrochem. Soc.
, vol.119
, pp. 507
-
-
Berger, J.1
-
17
-
-
34648814123
-
-
10.1063/1.2789701
-
T. Nishimura, K. Kita, and A. Toriumi, Appl. Phys. Lett., 91, 123123 (2007). 10.1063/1.2789701
-
(2007)
Appl. Phys. Lett.
, vol.91
, pp. 123123
-
-
Nishimura, T.1
Kita, K.2
Toriumi, A.3
-
18
-
-
0004005306
-
-
3rd ed., and 188, Wiley Interscience, New York.
-
S. M. Sze and K. K. Ng, Physics of Semiconductor Devices, 3rd ed., pp. 187 and 188, Wiley Interscience, New York (2007).
-
(2007)
Physics of Semiconductor Devices
, pp. 187
-
-
Sze, S.M.1
Ng, K.K.2
-
23
-
-
4243236112
-
-
10.1016/0039-6028(80)90145-4
-
C. W. Kao, L. Anderson, and C. R. Crowell, Surf. Sci., 95, 321 (1980). 10.1016/0039-6028(80)90145-4
-
(1980)
Surf. Sci.
, vol.95
, pp. 321
-
-
Kao, C.W.1
Anderson, L.2
Crowell, C.R.3
-
25
-
-
0014441917
-
-
10.1016/0038-1101(69)90135-X
-
C. R. Crowell, Solid-State Electron., 12, 55 (1968). 10.1016/0038- 1101(69)90135-X
-
(1968)
Solid-State Electron.
, vol.12
, pp. 55
-
-
Crowell, C.R.1
-
27
-
-
5244226795
-
-
10.1103/PhysRev.175.1072
-
R. Stratton and F. A. Padovani, Phys. Rev., 175, 1072 (1968). 10.1103/PhysRev.175.1072
-
(1968)
Phys. Rev.
, vol.175
, pp. 1072
-
-
Stratton, R.1
Padovani, F.A.2
-
28
-
-
57049138332
-
-
10.1143/APEX.1.051406
-
T. Nishimura, K. Kita, and A. Toriumi, Appl. Phys. Express, 1, 051406 (2008). 10.1143/APEX.1.051406
-
(2008)
Appl. Phys. Express
, vol.1
, pp. 051406
-
-
Nishimura, T.1
Kita, K.2
Toriumi, A.3
-
29
-
-
20344375915
-
-
Y. L. Chao, S. Prussin, J. C. S. Woo, and R. Scholz, Mater. Res. Soc. Symp. Proc., 829, B9.18.1 (2005).
-
(2005)
Mater. Res. Soc. Symp. Proc.
, vol.829
, pp. 9181
-
-
Chao, Y.L.1
Prussin, S.2
Woo, J.C.S.3
Scholz, R.4
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