Enhanced scratch resistance of polycarbonate by low temperature plasma-polymerized organosilica

Thin Solid Films

Volumn 517, Issue 17, 2009, Pages 5224-5230

  Lin, Yung Sen ^a   Liao, Ying Huei ^a   Weng, Mao Syuan ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

CVD; PC substrates; Plasma polymerization; Scratch resistance; Tetramethylsilane

Indexed keywords

ATOMIC COMPOSITIONS; CHEMICAL BONDINGS; CVD; LOW TEMPERATURE PLASMAS; ORGANOSILICA; OXYGEN PLASMAS; PC SUBSTRATES; ROOM TEMPERATURE; SCRATCH RESISTANCE; STEEL WOOL; SURFACE CHARACTERISTICS; SURFACE HARDNESS; TETRAMETHYLSILANE;

ATOMIC FORCE MICROSCOPY; ATOMS; CHEMICAL BONDS; CHEMICAL VAPOR DEPOSITION; FUNCTIONAL ELECTRIC STIMULATION; OXYGEN; PLASMA POLYMERIZATION; PLASMAS; POLYMERS; SCANNING ELECTRON MICROSCOPY; SILICON COMPOUNDS; SURFACE MORPHOLOGY; X RAY PHOTOELECTRON SPECTROSCOPY;

SUBSTRATES;

EID: 65649121234     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.03.181     Document Type: Article

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