Atmospheric-pressure plasma deposition of SiOx films for super-hydrophobic application

Thin Solid Films

Volumn 517, Issue 17, 2009, Pages 5284-5287

  Yang, Shih Hsien ^a   Liu, Chi Hung ^b   Su, Chun Hsien ^b   Chen, Hui ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Atmospheric plasma; Contact angle; Distance; SiOx; Super hydrophobic

Indexed keywords

AFM; ATMOSPHERIC PLASMA; ATMOSPHERIC PRESSURE PLASMAS; DEPOSITION MECHANISM; DEPOSITION PRECURSORS; DEPOSITION SYSTEMS; DISTANCE; FTIR; HEXAMETHYLDISILAZANE; IONIZATION GAS; OXYGEN FLOW RATES; PROCESS PARAMETERS; ROUGH SURFACES; SELF-ASSEMBLED; SEM; SIOX; SLIDING ANGLE; SMOOTH SURFACE; SUPER-HYDROPHOBIC; XPS;

ATMOSPHERIC CHEMISTRY; CHEMICAL VAPOR DEPOSITION; CONTACT ANGLE; FLOW RATE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROPHOBICITY; IONIZATION OF GASES; NOZZLES; OXYGEN; PLASMAS; SILICON COMPOUNDS; SURFACE MORPHOLOGY;

PLASMA DEPOSITION;

EID: 65649088339     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.03.083     Document Type: Article

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