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Volumn 28, Issue 1, 2009, Pages 33-43

Role of strain rate on the micromechanical characterization properties of 4N gold micro wire: Micro tensile and nanoindentation

Author keywords

Elastic modulus; Gold wire; Hardness; Nanoindentation; Strain rate; Yield strength

Indexed keywords


EID: 65449177718     PISSN: 1450216X     EISSN: 1450202X     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (8)

References (13)
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  • 2
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  • 3
    • 0037352863 scopus 로고    scopus 로고
    • Effects of Dopant, Temperature and Strain Rate on the Mechanical Properties of Micrometer Gold Bonding Wire
    • D.S. Liu and Y.C. Chao (2003), "Effects of Dopant, Temperature and Strain Rate on the Mechanical Properties of Micrometer Gold Bonding Wire", Journal of Electronic Materials, 32, No.3.
    • Journal of Electronic Materials , vol.32 , Issue.3
    • Liu, D.S.1    Chao, Y.C.2
  • 4
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    • Interface Reactions in Microelectronic Solder Joints and Associated Intermetallic Compounds:An Investigation of their Mechanical Properties using Nanoindentation
    • Electronics Packaging Technology Conference
    • H.J. Albrecht, A. Juritza, K. Muller. W.H. Mullerz. J. Sterthauz. J. Villain, A. Vogliano,(2003), "Interface Reactions in Microelectronic Solder Joints and Associated Intermetallic Compounds:An Investigation of their Mechanical Properties using Nanoindentation", Electronics Packaging Technology Conference
    • (2003)
    • Albrecht, H.J.1    Juritza, A.2    Muller, K.3    Mullerz, W.H.4    Sterthauz, J.5    Villain, J.6    Vogliano, A.7
  • 5
    • 4544316577 scopus 로고    scopus 로고
    • A Molecular Dynamics Study of the Tensile Behaviour of Ultrathin Gold Nanowires
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    • Ju, S.P.1    Lin, J.S.2    Lee, W.J.3
  • 7
    • 27744469011 scopus 로고    scopus 로고
    • Relationship between Mechanical Properties and Microstructure of Ultra Fine Gold Bonding Wires
    • K.S. Kim, J.Y. Song, E.K. Chung, J.K. Park and S.H. Hong (2006), "Relationship between Mechanical Properties and Microstructure of Ultra Fine Gold Bonding Wires", Journal of Mechanics and Materials, 38, pp. 119-127
    • (2006) Journal of Mechanics and Materials , vol.38 , pp. 119-127
    • Kim, K.S.1    Song, J.Y.2    Chung, E.K.3    Park, J.K.4    Hong, S.H.5
  • 8
    • 0027694552 scopus 로고
    • Strain-rate Sensitivity Index of Thermoplastics
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    • Goble, D.L.1    Wolff, E.G.2
  • 9
    • 33748754026 scopus 로고    scopus 로고
    • Strain Rate Effect on Tensile Behavior of the Helical Multi-Shell Gold Nanowires
    • P.J. Shin, J.L Wen, S.L. Jen, and L.L. Ming (2006), "Strain Rate Effect on Tensile Behavior of the Helical Multi-Shell Gold Nanowires". Material Chemistry and Physics. 100, pp. 48-53.
    • (2006) Material Chemistry and Physics , vol.100 , pp. 48-53
    • Shin, P.J.1    Wen, J.L.2    Jen, S.L.3    Ming, L.L.4
  • 10
    • 8744273821 scopus 로고    scopus 로고
    • Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds using Nanoindentation
    • M. Shah, K. Zeng and A.O. Tay (2004), "Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds using Nanoindentation", Journal of Electronic Packaging, 126, pp. 87-93.
    • (2004) Journal of Electronic Packaging , vol.126 , pp. 87-93
    • Shah, M.1    Zeng, K.2    Tay, A.O.3
  • 12
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  • 13
    • 32044456210 scopus 로고    scopus 로고
    • High Temperature Wire Sweep Characteristics of Semiconductor Package for Variable Loop-height Wirebonding Technology
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    • (2006) Journal of Microelectronic Engineering , vol.83 , pp. 197-205
    • Kung, H.K.1    Huang, B.W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.