The effect of thin film structure and properties on gold ball bonding

Journal of Electronic Materials

Volumn 27, Issue 11, 1998, Pages 1211-1215

  Krzanowski, J E ^a   Razon, E ^b   Hmiel, A F ^b  

^a University of New Hampshire   (United States)

^b Kulicke and Soffa Industries   (United States)

Author keywords

Aluminum metallization; Bondability; Gold ball bonding; Shear strength

Indexed keywords

ALUMINUM; FILM PREPARATION; GOLD; METALLIZING; SHEAR STRENGTH; THIN FILMS;

GOLD BALL BONDING;

METALLIC FILMS;

EID: 0032208042     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0071-x     Document Type: Article

References (5)

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3. James E. Krzanowski, IEEE Trans. CHMT. 13, 176 (1990).
4. J.E. Krzanowski, E. Razon and A.F. Hmiel, submitted to the Materials Research Society Fall Conf. Proc. November, 1997.
5. T.Y. Tsui, W.C. Oliver and G.M. Pharr, J. Mater. Res. 11, 760 (1996).