Direct nanomechanical machining of gold nanowires using a nanoindenter and an atomic force microscope

Journal of Micromechanics and Microengineering

Volumn 15, Issue 3, 2005, Pages 551-556

  Li, Xiaodong ^a   Nardi, Patrick ^a   Back, Chang Wook ^b   Kim, Jong Man ^b   Kim, Yong Kweon ^b  

^a University of South Carolina   (United States)

^b Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHARACTERIZATION; CURRENT VOLTAGE CHARACTERISTICS; ELECTRIC CONDUCTIVITY; ELECTRODES; FABRICATION; GOLD; MACHINING; PHOTOLITHOGRAPHY;

GOLD NANOWIRES; NANOCHANNELS; NANOINDENTER; NANOMECHANICAL CHARACTERIZATION; NANOMECHANICAL MACHINING;

NANOSTRUCTURED MATERIALS;

EID: 15544373416     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/3/016     Document Type: Article

References (19)

1. Li X, Bhushan B, Takashima K, Back C-W and Kim Y-K 2003 Ultramicroscopy 97 481-97
2. Li X and Bhushan B 2003 Surf. Coat. Technol. 164 503-8
3. Haque M A and Saif M T 2004 Proc. Natl Acad. Sci. USA 101 6335-40
4. Li X and Bhushan B 2002 Mater. Charact. 48 11-36
5. Bhushan B and Li X 2003 Int. Mater. Rev. 48 125-64
6. Li X, Gao H, Murphy C J and Caswell K K 2003 Nano Lett. 3 1495-8
7. Pallandre A, Glinel K, Jonas A M and Nysten B 2004 Nano Lett. 4 365-71
8. Yu Z and Chou S Y 2004 Nano Lett. 4 341-4
9. Guo L J, Cheng X and Chou C F 2004 Nano Lett. 4 69-73
10. Marian K, Lee W K, LaMattina B, Caster K C and Zauscher S 2004 Nano Lett. 4 311-6
11. Lee S, Kim J, Shin W S, Lee H J, Koo S and Lee H 2004 Mater. Sci. Eng. C 24 3-9
12. Chimmalgi A, Choi T Y, Grigoropoulos C P and Komvopoulos K 2003 Appl. Phys. Lett. 82 1146-8
13. Chien F S S, Wu C L, Chou Y C, Chen T T and Gwo S 1999 Appl. Phys. Lett. 75 2429-31
14. Fang T H and Chang W J 2003 J. Phys. Chem. Solids 64 913-8
15. Schumacher H W, Keyser U F, Zeitler U and Haug R J 1999 Appl. Phys. Lett. 75 1101-9
16. Tan S, Tang Z, Liang X and Kotov N A 2004 Nano Lett. 4 1637-41
17. Dashiell W, Troeger R T, Rommel S L, Adam T N, Berger P R, Guedj C, Kolodzey J, Seabaugh A C and Lake R 2000 IEEE Trans. Electron Devices 47 1707-14
18. Reed M A, Zhou C, Muller C J, Burgin T P and Tour J M 1997 Science 278 252-4
19. Kashimura Y, Nakashima H, Furukawa K and Torimitsu K 2003 Thin Solid Films 438 317-21