Effects of dopant, temperature, and strain rate on the mechanical properties of micrometer gold-bonding wire

Journal of Electronic Materials

Volumn 32, Issue 3, 2003, Pages 159-165

  Liu, D S ^a   Chao, Y C ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Constitutive model; Dopant; Gold wire; Microforce tensile test

Indexed keywords

COMPOSITION EFFECTS; DOPING (ADDITIVES); ELASTIC MODULI; MATHEMATICAL MODELS; MICROELECTRONICS; STRAIN RATE; STRESSES; TENSILE TESTING; THERMAL EFFECTS; WIRE PRODUCTS;

EMPIRICAL CONSTITUTIVE MODEL; GOLD-BONDING WIRE; LOAD RATES; STRESS-STRAIN CURVES; THERMOMECHANICAL PROPERTIES;

GOLD;

EID: 0037352863     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0187-y     Document Type: Article

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