Mechanical characterization of the heat affected zone of gold wirebonds using nanoindentation

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 87-93

  Shah, Mithilesh ^a   Zeng, Kaiyang ^b   Tay, Andrew A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HARDNESS; HEAT AFFECTED ZONE; INDENTATION; NANOTECHNOLOGY; STRESSES;

NANOINDENTATION; OXIDE POLISHING; STRESS PROFILE; WIREBONDS;

SOLDERING;

EID: 8744273821     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1648062     Document Type: Article

References (13)

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