Understanding of delamination mechanism of anisotropic conductive film (ACF) bonding in thin liquid crystal display (LCD) module

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 3, 2007, Pages 509-516

  Xie, Bin ^a   Qign, Xun ^b   Ding, Han ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Anisotropic conductive film (ACF); Chip on glass (COG); Delamination mechanism; Finite element analysis (FEA); Global local modeling

Indexed keywords

ANISOTROPIC CONDUCTIVE FILM (ACF); ANISOTROPIC CONDUCTIVE FILM BONDINGS; BONDING PROCESS; CHIP-ON-GLASS (COG); CRITICAL PARAMETERS; ELASTIC PLASTICS; FINITE ELEMENT ANALYSIS (FEA); GLASS SUBSTRATES; GLOBAL-LOCAL MODELING; HIGH QUALITIES; LCD MODULES; LIQUID-CRYSTAL DISPLAY PANELS; LOCAL MODELS; MANUFACTURABILITY; TEMPERATURE DIFFERENCES; THERMAL-MECHANICAL ANALYSIS; THIN LIQUIDS;

ANISOTROPY; CONDUCTIVE FILMS; DELAMINATION; FINITE ELEMENT METHOD; GLASS; INTEGRATED CIRCUITS; LIGHT SOURCES; LIQUID CRYSTAL DISPLAYS; LIQUID CRYSTALS; MECHANISMS; SPURIOUS SIGNAL NOISE; STEEL SHEET;

GLASS BONDING;

EID: 65449171594     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.898697     Document Type: Article

References (12)

1. H. Kristiansen and J. Liu, "Overview of conductive adhesive interconnection technologies for LCD," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, no. 2, pp. 208-214, Jun. 1998.
2. L. L. Mercado, J. White, V. Sarjhan, and T. T. Lee, "Failure mechanism study of Anisotropic Conductive Film (ACF) packages," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 3, pp. 509-516, Sep. 2003.
3. A. Seppala and E. Ristolainen, "Study of adhesive flip chip bonding process and failure mechanisms of ACF joints," Microelectron. Rel. vol. 44, pp. 639-648, 2004.
4. A. Seppala, S. Pienimaa, and E. Ristolainen, "Flip chip joining on FR-4 substrate using ACFs," J. Microcirc. Electron. Packag., vol. 24, no. 2, pp. 148-159, 2001.
5. D. D. Chang, "An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly," IEEE Trans. Comp., Hybrids, Manuact. Technol., vol. 16, no. 8, pp. 828-835, Dec. 1993.
6. R. Dudek, S. Meinel, A. Schubert, and B. Michel, "Flow characterization and thermo-mechanical response of anisotropic conductive films," IEEE Trans. Compon. Packag. Technol., vol. 22, no. 2, pp. 177-185, Jun. 1999.
7. K. N. Chiang, C. W. Chang, and C. T. Lin, "Porcess modeling and thermal/mechanical behavior of ACA/ACF type flip-chip packages," J. Electron. Packag., vol. 123, pp. 331-337, 2001.
8. M. J. Yim and K. W. Paik, "Design and understanding of anisotropic conductive films for LCD packaging," IEEE Trans. Comp., Hybrids, Manuact. Technol. A, vol. 21, no. 2, pp. 226-234, Jun. 1998.
9. Y. N. Cheng, S. Lee, and J. Lee, "Finite element analysis of anisotropic conductive film for chip on glass process," Mater. Manufact. Process., vol. 17, no. 6, pp. 765-781, 2002.
10. A. Bejan and A. D. Kraus, Heat Transfer Handbook. New York: Wiley, 2003.
11. R. Siegel and J. R. Howell, Thermal Radiation Heat Transfer. Bristol, PA: Hemisphere, 1981.
12. X. Q. Shi, H. L. J. Pang, X. R. Zhang, Q. J. Liu, and M. Ying, "In-situ micro-digital image speckle correlation technique for characterization of materials' properties and verification of numerical models," IEEE Trans. Compon. Packag. Technol., vol. 27, no. 4, pp. 659-667, Dec. 2004.