Hydrophobic films by atmospheric plasma curing of spun-on liquid precursors

Langmuir

Volumn 25, Issue 4, 2009, Pages 2495-2500

  Barankin, Michael D ^a   Gonzalez II, Eleazar ^a   Habib, Sara B ^a   Gao, Li ^a   Guschl, Peter C ^b   Hicks, Robert F ^a,b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Surfx Technologies LLC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AFTER TREATMENTS; ATMOSPHERIC PLASMAS; ATMOSPHERIC PRESSURE PLASMAS; ATOMIC RATIOS; COATED GLASS; FLUOROALKYLSILANE; HYDROPHOBIC COATINGS; HYDROPHOBIC FILMS; LIQUID PRECURSORS; LOW TEMPERATURES; NITROGEN PLASMAS; POLAR COMPONENTS; RADIO FREQUENCIES; REACTIVE SPECIES; SI ATOMS; SURFACE ENERGIES; WATER CONTACT ANGLES; X-RAY PHOTOELECTRON SPECTROSCOPIES;

ATMOSPHERIC PRESSURE; ATOMIC SPECTROSCOPY; CONTACT ANGLE; DISSOLUTION; GLASS; HELIUM; HYDROPHOBICITY; LIQUIDS; PARAFFINS; PLASMAS; SURFACE CHEMISTRY; SURFACE TENSION;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 65249103239     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la803791j     Document Type: Article

References (37)

1. Balu, B.; Breedveld, V.; Hess, D. W. Langmuir 2008, 24, 4785-4790.
2. Teshima, K.; Sugimura, H.; Inoue, Y.; Takai, O. Langmuir 2003,19,8331-8334.
3. Hayashi, K.; Saito, N.; Sugimura, H.; Takai, O.; Nakagiri, N. Langmuir 2002, 18, 7469-7472.
4. Jung, G.-Y.;Li, Z.; Wu, W.; Chen, Y.; Olynick, D. L.; Wang, S.-Y.;Tong, W. M.; Williams, R. S. Langmuir 2005, 21, 1158-1161.
5. Arima, Y.; Iwata, H. Biomaterials 2007, 28, 3074-3082.
6. Patel, K. R.; Tang, H.; Grever, W. E.; Simon Ng, K. Y.; Xiang, J.; Keep, R. F.; Cao, T.; McAllister, J. P., II. Biomaterials 2006, 27, 1519-1526.
7. Hozumi, A.; Ushiyama, K.; Sugimura, H.; Takai, O. Langmuir 1999, 15, 7600-7604.
8. Sugimura, H.; Hozumi, A.; Kameyama, T.; Takai, O. Surf. Interface Anal. 2002, 34, 550-554.
9. Clarotti, G.; Aoumar, A. A. B.; Schue, F.; Sledz, J.; Geckeler, K. E.; Flosch, D.; Orsetti, A. Makromol. Chem. 1991, 192, 2581-2590.
10. Clarotti, G.; Schue, F.; Sledz, J.; Aoumar, A. A. B.; Geckeler, K. E.; Orset, A.; Paleirac, G. Biomaterials 1991, 13, 832-840.
11. Takai, O.; Hozumi, A.; Sugimoto, N. J. Non-Cryst. Solids 1997, 218, 280-285.
12. Nakajima, A.; Abe, K.; Hashimoto, K.; Watanabe, T. Thin Solid Films 2000, 376, 140-143.
13. Yamanaka, M.; Sada, K.; Miyata, M.; Hanabusad, K.; Nakano, K. Chem. Commun. 2006, 21, 2248-2250.
14. Nagai, M.; Takai, O.; Hori, M. Jpn. J. Appl. Phys. 2006, 45, L460-L462.
15. Gonzalez, E.; Barankin, M. D.; Guschl, P. C.; Hicks, R. F. Langmuir 2008, 24(21), 12636-12643.
16. Nowling, G. R.; Yajima, M.; Babayan, S. E.; Moravej, M.; Yang, X.; Hoffman, W.; Hicks, R. F. Plasma Sources Sci. Technol. 2005, 14, 477-484.
17. Janczuk, B.; Zdziennicka, A. J. Mater. Sci. 1994, 29, 3559-3564.
18. Owens, D. K.; Wendt, R. C. J. Appl. Polym. Sci. 1969, 13, 1741-1747.
19. Kalble, D. H. J. Adhes. 1970, 2, 66-81.
20. XPS Database; National Institute of Standards & Technology (NIST): Gaithersburg, MD, 2008; http://srdata.nist.gov/xps/.
21. PHI Reference Tables; Physical Electronics Inc.; Eden Prairie, MN, 1996; Vol. 629713 Rev B.
22. Srivannavit, O.; Gulari, M.; Gulari, E.; LeProust, E.; Pellois, J. P.; Gao, X.; Zhou, X. Sens Actuators. 2004, 116, 150-160.
23. Laguardia, L.; Ricci, D.; Vassallo, E.; Cremona, A.; Mesto, E.; Grezzi, F.; Dellera, F. Macromol. Symp. 2007, 247, 295-302.
24. Thurston, R. M.; Clay, J. D.; Schulte, M. D. J. Plast. Film Sheeting 2007, 23, 63-78.
25. Schulz, U.; Munzert, P.; Kaiser, N. Surf. Coat. Technol. 2001, 142-144, 507-511.
26. Shenton, M. J.; Stevens, G. C.; Wright, N. P.; Duan, X. J. Polym. Sci., Part A: Polym. Chem. 2001, 40, 95-109.
27. Lim, H.; Lee, Y.; Han, S.; Cho, J.; Kim, K.-J. J. Vacuum Sci. Technol., A 2001, 19, 1490-1496.
28. Kitova, S.; Minchev, M.; Danev, G. J. Optoelectron. Adv. Mater. 2005, 7, 249-52.
29. Gonzalez, E., II; Barankin, M. D.; Guschl, P. C.; Hicks, R. F. Langmuir2008, 24, 12636-12643.
30. Liston, E. M.; Martinu, L.; Wertheimer, M. R. J. Adhes. Sci. Technol. 1993, 7, 1091-1127.
31. Saini, G.; Sautter, K.; Hild, F. E.; Pauley, J.; Linford, M. R. J. Vac. Sci. Technol., A 2008, 26, 1224-34.
32. Hong, L.; Sugimura, H.; Furukawa, T.; Takai, O. Langmuir 2003, 19, 1966-1969.
33. Schondelmaier, D.; Cramm, S.; Klingeler, R.; Morenzin, J.; Zilkens, C.; Eberhardt, W. Langmuir 2002, 18, 6242-6245.
34. Gusev, E. P.; Lu, H. C.; Gustafsson, T.; Garfunkel, E. Phys. Rev. B 1995, 52, 1759-1775.
35. Feng, L.; Li, S.; Li, Y.; Li, H.; Zhang, L.; Zhai, J.; Song, Y.; Liu,B.; Jiang, L.; Zhu, D. Adv. Mater. 2002, 14, 1857-1860.
36. Suzuki, S.; Nakajima, A.; Yoshida, N.; Sakai, M.; Hashimoto, A.; Kameshima, Y.; Okada, K. Langmuir 2007, 23, 8674-8677.
37. Nosonovsky, M.; Bhushan, B. J. Phys.; Condens. Matter 2008, 20, 1-30.