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Physica Status Solidi (A) Applied Research

Volumn 201, Issue 12, 2004, Pages 2786-2790

High-power GaN light-emitting diodes with patterned copper substrates by electroplating

(7) Horng, R H a Lee, C E a Hsu, S C a Huang, S H a Wu, C C a Kung, C Y a Wuu, D S a

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTROPLATING; HEATING; LIGHT EMITTING DIODES; LUMINESCENCE; NITROGEN; PHOTOLITHOGRAPHY; THERMAL CONDUCTIVITY; ANISOTROPY; COPPER; PHOTODETECTORS; SUBSTRATES;

CHIP STRUCTURE; DICING PROCESS; INJECTION CURRENT; METALLIC SUBSTRATES; HEAT SINK; ILLUMINATION APPLICATIONS; LIGHT SIGNALS; METALLIC SUBSTRATE;

GALLIUM COMPOUNDS; GALLIUM NITRIDE;

EID: 7044269419 PISSN: 00318965 EISSN: None Source Type: Journal
DOI: 10.1002/pssa.200405091 Document Type: Conference Paper

Times cited : (20)

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