Toward a better understanding of morphology changes in solders using phase field theories: Quantitative modeling and experimental verification

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 404-409

  Brodie, D S ^a   Gunn, A J ^a   Muller W H ^b   Reuben, R L ^a  

^a HERIOT WATT UNIVERSITY   (United Kingdom)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EUTECTICS; FREE ENERGY; GIBBS FREE ENERGY; LENNARD-JONES POTENTIAL; PHASE SEPARATION; SOLDERING ALLOYS;

COARSENING BEHAVIOR; EXPERIMENTAL VERIFICATION; GRADIENT ENERGY COEFFICIENTS; MATERIAL PARAMETER; MICROSTRUCTURAL DEVELOPMENT; NUMERICAL PROCEDURES; QUANTITATIVE MODELING; SUBLIMATION ENERGY;

LEAD-FREE SOLDERS;

EID: 6444239589     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185706     Document Type: Conference Paper

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