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Thin Solid Films

Volumn 517, Issue 12, 2009, Pages 3424-3426

Degradation and silicidation of Ta- and W-filaments for different filament temperatures

(4) Kniffler, N a Pflueger, A a Scheller, D a Schroeder, B b

a MANNHEIM UNIVERSITY OF APPLIED SCIENCES (Germany)

b France (Germany)

Author keywords

Filament degradation; Hot wire deposition; Tantalum silicidation; Tungsten silicidation

Indexed keywords

CHEMICAL VAPOUR DEPOSITIONS; CONSTANT CURRENTS; DEPOSITION CHAMBERS; FILAMENT DEGRADATION; FILAMENT TEMPERATURES; HIGH QUALITIES; HOT WIRE DEPOSITION; MATERIAL CHANGES; OPTIMUM TEMPERATURES; SEM; SILICIDE LAYERS; THIN SILICON FILMS; TUNGSTEN FILAMENTS;

DEGRADATION; SCANNING ELECTRON MICROSCOPY; SILANES; SILICIDES; TANTALUM; TRANSITION METALS; TUNGSTEN; WIRE;

FILAMENTS (LAMP);

EID: 64349101085 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2009.01.025 Document Type: Article

Times cited : (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.