Temperature behaviour of capacitive pressure sensor fabricated with LTCC technology

Informacije MIDEM

Volumn 38, Issue 3, 2008, Pages 191-196

  Belavič, Darko ^a,b   Zarnik, Marina Santo ^a   Hrovat, Marko ^b   Maček, Srečko ^b   Kosec, Marija ^b  

^a doo   (Slovenia)

^b JO EF STEFAN INSTITUTE   (Slovenia)

Author keywords

Capacitive pressure sensor; Pressure sensor; Sensor; Temperature behaviour; Thick film technology

Indexed keywords

EID: 63849297276     PISSN: 03529045     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)

1. N. M. White, J. D. Turner, "Thick film sensors: past, present and future", Measurements. Sci. Technol., Vol. 8, No. 1, pp. 1-20, 1997.
2. M. Pavlin, D. Belavič, M. Santo Zarnik, M. Hrovat, M. Možek, "Packaging technologies for pressure-sensors". Microelectronics International, Vol. 19, pp. 9-13, 2002.
3. T. Thelemann, H. Thust, M. Hintz, "Using LTCC for microsystems", Microelectronics International, Vol. 19, No. 3, pp. 19-23, 2002.
4. M. Pavlin, F. Novak, "Yield enhancement of piezoresistive pressure sensors for automotive applications", Sensors and Actuators, A, Physical, Vol. 141, No. 1, pp. 34-42, January 2007.
5. D. Belavič, M. Hrovat, M. Pavlin, M. Santo Zarnik, "Thick-film technology for Sensor Applications", Informacije MIDEM, Vol. 33, pp. 45-48, 2003.
6. L.J. Golonka, A. Dziedzic, J. Kita, T. Zawada, "LTCC in microsystem application", Informacije MIDEM, Vol. 32, No. 4, pp. 272-279, December 2002.
7. T. Thelemann, H. Thust, M. Hintz, "Using LTCC for Microsystems", Microelectronics International, Vol. 19, pp. 19-23, 2002.
8. C. J. Ting, C.S. Hsi, H.J. Lu, "Interactions between ruthenium-based resistors and cordierite-glass substrates in low temperature co-fired ceramics", Journal of the American Ceramics Society, Vol. 83, pp. 23945-2953, 2000.
9. A.A. Shapiro, D.F. Elwell, P. Imamura, M.L. MeCartney, "Structure-property relationships in low-temperature cofired ceramic", Proceedings of the 1994 International Symposium on Microelectronics ISHM-94, Boston, Massachusetts, pp. 306-311, 1994.
10. R. Puers, "Capacitive sensors; when and how to use them", Sensors and Actuators A, Vol. 37, pp. 93-105, 1993
11. C. B. Sippola, C. H. Ahn, "A thick film screen-printed ceramic capacitive pressure microsensor for high temperature applications", Journal of Micromechanics and Microengineering, Vol. 16, pp. 1086-1091, 2006.
12. J.I. Pavlič, M. Santo Zarnik, D. Belavič, "Feasibility study of a ceramic capacitive pressure sensor", Proceedings. Ljubljana; MIDEM - Society for Microelectronics, Electronic Components and Materials, pp. 95-100, 2006.
13. M. Yamada, T. Takebayashi, S. I. Notoyama, K. Watanabe, "A Switched-Capacitor Interface for Capacitive Pressure Sensors", IEEE Transactions on Instrumentation and Measurement, Vol. 41, No. 1, pp. 81-86, February 1992.
14. D. Belavič, M. Santo Zarnik, M. Jerlah, M. Pavlin, M. Hrovat, S. Maček, "Capacitive thick-film pressure sensor: material and construction investigation", Proceedings of the XXXI International Conference of IMAPS Poland 2007, Rzeszóv, Krasiczyn, Poland, pp. 249-253, September 23-26, 2007.
15. D Crescini, V Ferrari, D Marioli and A Taroni, "A thick-film capacitive pressure sensor with improved linearity due to electrode-shaping and frequency conversion", Meas. Sci. Technol. Vol. 8, pp. 71-77, 1997.