Suspended si microstructures with rounded concave and sharp convex corners using wafer bonding and wet anisotropic etching

ECS Transactions

Volumn 16, Issue 8, 2009, Pages 133-140

  Pal, Prem ^a   Sato, K ^a   Shikida, M ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC ETCHING; ANISOTROPY; MICROSTRUCTURE; SILICON WAFERS; SURFACE ACTIVE AGENTS;

CMOS COMPATIBILITY; CONVEX CORNERS; ETCH DEPTH; FABRICATION METHOD; FABRICATION PROCESS; SILICON MICROSTRUCTURES; TRITON X-100; WET ANISOTROPIC ETCHING;

WAFER BONDING;

EID: 63149174357     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2982862     Document Type: Conference Paper

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