High-temperature spin-on adhesives for temporary wafer bonding

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 105-111

  Pillalamarri, S ^a   Puligadda, R ^a   Brubaker, C ^b   Wiinplinger, M ^b   Pargfrieder, S ^c  

^a BREWER SCIENCE INC   (United States)

^b EV Group Inc   (United States)

^c EV GROUP   (Austria)

Author keywords

Spin on adhesives; Temporary adhesives; Temporary wafer bonding; Wafer thinning

Indexed keywords

FLEXIBLE SUBSTRATE; HIGH TEMPERATURE; HIGH TEMPERATURE STABILITY; OPERATING TEMPERATURE; PERFORMANCE REQUIREMENTS; PROCESSING WINDOWS; SPIN-ON; WAFER THINNING;

ADHESIVES; DEBONDING; MICROELECTRONICS;

WAFER BONDING;

EID: 58449083141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

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