A chemical and thermal resistant wafer bonding adhesive simplifying wafer backside processing

2006 International Conference on Compound Semiconductor Manufacturing Technology

Volumn , Issue , 2006, Pages 269-271

  Smith, A ^a   Moore, J ^b   Hosse, B ^c  

^a BREWER SCIENCE INC   (United States)

^b DAETEC LLC   (United States)

^c RF MICRO DEVICES   (United States)

Author keywords

Adhesive; Bonding; Etching; Mounting; Thinning; Waferbond

Indexed keywords

BONDING ADHESIVE; HIGH RESISTANCE; LOW TEMPERATURES; PROCESS CONDITION; PROCESS LINE; STRONG ACIDS; THINNING; WAFERBOND;

ADHESIVES; BONDING; ETCHING; HEAT RESISTANCE; MOUNTINGS; SEMICONDUCTOR DEVICE MANUFACTURE;

CHEMICAL BONDS;

EID: 70549086817     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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2. Mould, and J. Moore, A New Alternative for Temporary Wafer Mounting, GaAs MANTECH, Technical Digest, pp.109-112, April 2002.
3. Hendriks, Bharat Patel, Jim Crites and J. Moore, Back-side Processing Poses New Challenges to GaAs, Compound Semiconductor Magazine, pp.85-88, November (2001).
4. Muller, P. Stampka, W. Kroninger, E. Gaulhofer, and H, Oyrer, Smart Card Assembly Requires Advanced Pre-Assembly Methods, Semiconductor International, pp.191-200, July (2000).
5. WaferBOND™ is a new spin-on adhesive for wafer process, part of a line of specialty materials provided by Brewer Science, Inc., Rolla, MO. 2006.
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9. J. Moore, S. Luna, T. Rivers, B. Howell, C. Becker, Removal of Gold Impregnated Post-Etch Residue from Front and Backside Vias in a Single Process, 2005 CS MANTECH Technical Digest, pp. 273-276, April 2005.
10. D. Bonneau, P. Borkowski, R. Shelly, A. Fortier, M.C. Young et al. Capability and Cycle Time Improvements in Nortel Network's Substrate Via Fab, 2002 GaAs MANTECH Technical Digest, pp. 113-116, April 2002.
11. M. Huffman et. al, Dry Etching of Deep Backside Vias in InP, 2003 GaAs MANTECH Technical Digest, .