Ultrathin-wafer processing utilizing temporary bonding and debonding technology

Semiconductor Technology, ISTC2007 - Proceedings of the 6th International Conference on Semiconductor Technology

Volumn , Issue , 2006, Pages 878-888

  Pargfrieder, Stefan ^a   Kettner, Paul ^a   Wimplinger, Markus ^a   Puligadda, Rama ^b  

^a EV GROUP   (Austria)

^b BREWER SCIENCE INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRONICS PACKAGING; MECHANICAL STABILITY; MICROELECTRONICS; SILICON WAFERS; TEMPERATURE; WAFER BONDING;

CARRIER WAFERS; EMERGING APPLICATIONS; FUTURE APPLICATIONS; MANUFACTURING CHALLENGES; MANUFACTURING PROCESS; MICROELECTRONIC INDUSTRY; SPIN-ON; TEMPORARY BONDINGS; ULTRA-THIN; WAFER PROCESSING;

DEBONDING;

EID: 58449085222     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. P.J. Taylor, W.A. Jesser, J.D. Benson, M. Martinka, J.H. Dinan, J. Bradshaw, M. Lara-Taysing, R.P. Leavitt, G. Simonis, W. Chang, W.W. Clarck III, and K.A. Bertness, J. of Appl. Phys., 89, pp. 4365-4375, 2001.
2. th International Symposium on Microelectronics, October 8-12, 2006, pp. 105-111.