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Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting

Volumn , Issue , 2005, Pages 169-173

Silicon Based System-in-Package : A passive integration technology combined with advanced packaging and system based design tools to allow a breakthrough in miniaturization

(1) Murray, F a

a NXP SEMICONDUCTORS (Netherlands)

Author keywords

Energy management; Integrated circuit design; Interconnections; Packaging; Passive circuits; Reliability; System analysis and design

Indexed keywords

ENERGY MANAGEMENT; INTEGRATED CIRCUITS; INTERCONNECTION NETWORKS; PACKAGING; RELIABILITY; SILICON; SYSTEMS ANALYSIS;

INTEGRATED CIRCUIT DESIGN; SYSTEM ANALYSIS AND DESIGN;

PASSIVE NETWORKS;

EID: 27944462287 PISSN: 10889299 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (23)

References (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.