Simulation of scattering parameter of signal via with shielding vias

Proceedings of the 2005 IEEE International Workshop on VLSI Design and Video Technology, IWVDVT 2005

Volumn , Issue , 2005, Pages 57-59

  Ji, Wusheng ^a   Wang, Xuedong ^b   Li, Ying ^c  

^a Lanzhou Teachers College   (China)

^b Centurion Electron (Shanghai) Ltd   (China)

^c SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMMUNICATION SYSTEMS; COMPUTER SIMULATION; ELECTRIC LINES; ELECTROMAGNETIC WAVES; MATHEMATICAL MODELS; RESONANCE; SCATTERING PARAMETERS;

COMMUNICATION TECHNOLOGY; ELECTRONIC DEVICES; INTERCONNECTION STRUCTURE; TEM WAVES;

SIGNAL PROCESSING;

EID: 23844537209     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. T. Dixon, "Multilayer ceramics: the key to high density interconnections", Electronic packaging Production, pp. 76-82, 1983.
2. Q. Gu, Y. E. Yang, and M. A. Tassoudji, "Modeling and analysis of vias in multilayered integrated circuit", IEEE Trans. Microwave Theory Tech., 41(2), pp. 206-214, 1993.
3. Ramesh Abhari, George V. Eleftheriades, and Emilie Van Deventer-Perkins, "Physics-based CAD models for the analysis of vias in parallel-plate environments", IEEE Trans. Microwave Theory Tech., 49 (10), pp. 1697-1706, 2001.
4. Show-Gwo Hsu, and Ruey-Beei Wu, "full-wave Characterization of a through hole via discontinuity in multi-layered packaging", IEEE 3rd Topical Meeting on Electrical Performance of Electronic packaging, 2-4 Nov, pp. 219-222, 1994.
5. Yan Wei, Hong Wei, and Xue Yu, "LTCC Microwave Multichip Modules", Acta Electronica Sinica, 30 (5), pp. 711-714, 2002.
6. Wusheng Ji, Bin You, Xuedong Wang, and Ying Li, "relationship between the propagation characteristics of via and microstrip connecting angle", Microwave and Optical Technology Letters, 38(3), pp. 225-228, 2003.