Processor frequency assignment in three-dimensional MPSoCs under thermal constraints by polynomial programming

IEEE Asia-Pacific Conference on Circuits and Systems, Proceedings, APCCAS

Volumn , Issue , 2008, Pages 1668-1671

  Zhao, Guangyao ^a   Kwan, Hing Kit ^a   Lei, Chi Un ^a   Wong, Ngai ^a  

^a UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

3D thermal model; Frequency assignment; Multi Processor Systems on Chips; Polynomial programming

Indexed keywords

3D MP-SOC; 3D THERMAL MODEL; ACTIVE LAYERS; DYNAMIC VOLTAGE AND FREQUENCY SCALING; FREQUENCY ASSIGNMENT; INTRA LAYERS; MAXIMUM TEMPERATURES; MULTI-PROCESSOR SYSTEMS-ON-CHIPS; OPERATING FREQUENCIES; OPERATING TEMPERATURES; OPTIMIZATION APPROACHES; PERFORMANCE IMPROVEMENTS; POLYNOMIAL PROGRAMMING; POWER CONSTRAINTS; POWER DENSITIES; SYSTEM RELIABILITIES; TEMPERATURE CORRELATIONS; THERMAL CHARACTERISTICS; THERMAL CONSTRAINTS; THERMAL IMPACTS; THERMAL MODELING; THERMAL OPTIMIZATIONS; THREE-DIMENSIONAL (3D); TIME INSTANCES; TOTAL SYSTEM PERFORMANCE; TWO-DIMENSIONAL;

CONSTRAINED OPTIMIZATION; MULTIPROCESSING SYSTEMS; POLYNOMIAL APPROXIMATION; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

THREE DIMENSIONAL;

EID: 62949097046     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APCCAS.2008.4746358     Document Type: Conference Paper

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