Microstructures and tensile deformation behavior of Cu-16 wt.%Ag binary alloy

Materials Science and Engineering: A

Volumn 508, Issue 1-2, 2009, Pages 209-213

  Tian, Y Z ^a   Zhang, Z F ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Cu Ag alloy; Eutectic; Microstructure; Precipitates; Slip bands; Tensile deformation

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; DEFORMATION; EUTECTICS; PRECIPITATES; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; STRAIN HARDENING; STRESS-STRAIN CURVES;

COARSE GRAINS; CUBE ORIENTATION; DEFORMATION BEHAVIOR; ELECTRON BACK-SCATTERED DIFFRACTION; HIGH ELONGATION; MATRIX; PROEUTECTIC; SCANNING ELECTRONS; SLIP BAND; TENSILE DEFORMATION;

MICROSTRUCTURE;

EID: 62849098692     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2008.12.050     Document Type: Article

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