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Volumn 93, Issue 1, 2002, Pages 58-65

Microstructure and mechanical properties of Cu-Ag microcomposites for conductor wires in pulsed high-field magnets

Author keywords

Aging; Cold working; Cu Ag alloys; Mechanical properties; Microstructure

Indexed keywords

AGING OF MATERIALS; COMPOSITION; ELECTRIC WIRE; GRAIN BOUNDARIES; HARDENING; HEAT TREATMENT; METALLOGRAPHIC MICROSTRUCTURE; PERMANENT MAGNETS; PRECIPITATION (CHEMICAL); SOLID SOLUTIONS; SOLIDIFICATION; TENSILE STRENGTH;

EID: 0036162691     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.020058     Document Type: Article
Times cited : (40)

References (33)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.