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Volumn 93, Issue 1, 2002, Pages 58-65
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Microstructure and mechanical properties of Cu-Ag microcomposites for conductor wires in pulsed high-field magnets
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IFW DRESDEN
(Germany)
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Author keywords
Aging; Cold working; Cu Ag alloys; Mechanical properties; Microstructure
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Indexed keywords
AGING OF MATERIALS;
COMPOSITION;
ELECTRIC WIRE;
GRAIN BOUNDARIES;
HARDENING;
HEAT TREATMENT;
METALLOGRAPHIC MICROSTRUCTURE;
PERMANENT MAGNETS;
PRECIPITATION (CHEMICAL);
SOLID SOLUTIONS;
SOLIDIFICATION;
TENSILE STRENGTH;
CAST BILLETS;
COLD DEFORMATION;
COOLING VELOCITY;
DENDRITES;
PHASE BOUNDARY HARDENING;
SOLID SOLUTION HARDENING;
COPPER ALLOYS;
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EID: 0036162691
PISSN: 00443093
EISSN: None
Source Type: Journal
DOI: 10.3139/146.020058 Document Type: Article |
Times cited : (40)
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References (33)
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