Evolution of microstructure and electrical resistivity of Cu-12wt.%Ag filamentary microcomposite with drawing deformation

Scripta Materialia

Volumn 52, Issue 12, 2005, Pages 1187-1191

  Zhang, L ^a   Meng, L ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Copper alloys; Deformation structure; Drawing; Electrical resistivity; Fiber reinforced composites

Indexed keywords

DEFORMATION; ELECTRIC CONDUCTIVITY; FIBER REINFORCED MATERIALS; HEAT TREATMENT; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

COPPER MOULDS; DEFORMATION STRUCTURES; DRAWING; FIBER REINFORCED COMPOSITES;

COPPER;

EID: 16344376074     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.03.016     Document Type: Article

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